LaserOrigami (LO) of three-dimensional (3D) components: Experimental analysis and numerical modeling-part II
نویسندگان
چکیده
منابع مشابه
Thermal Modeling and Analysis of Three- Dimensional (3d) Chip Stacks
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ژورنال
عنوان ژورنال: Journal of Manufacturing Processes
سال: 2019
ISSN: 1526-6125
DOI: 10.1016/j.jmapro.2019.02.026